GConferenceGridThe Conference Catalogue · Vol. 2026Folio № 66ABC3
Of the Field

DAC 2026

T

he Design Automation Conference (DAC) is a premier event in the fields of electronic design automation (EDA), embedded systems, AI, security, and system design. Bringing together industry leaders, academic experts, and the world’s most innovative companies, DAC 2026 features technical sessions, keynote speakers, and an exhibition showcasing the latest advan…

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12Voices
15Underwriters
0Exhibitors
5On the bill · sessions
25Companies · in total
§I

The Voices

Programmed at DAC, in alphabetical order.
Amit Gupta
Senior VP, EDA AI and Custom IC · Siemens DISW
Artour Levin
Corporate Vice President, AI Silicon Engineering · Microsoft
Dr. Baaziz Achour
EVP and Chief Technology Officer · Qualcomm Technologies, Inc.
Dr. Huiming Bu
Vice President, Global Semiconductors R&D and Albany Operations · IBM Research
Dylan Patel
Founder, CEO, and Chief Analyst · SemiAnalysis
Jan M. Rabaey
Professor Emeritus · University of California at Berkeley
Jay Vleeschhouwer
Managing Director · Griffin Securities
Jeffrey Z. Pan
Co-Founder and CTO · Bronco AI
John Martinis
CTO & Co-Founder Qolab and 2025 Nobel Laureate in Physics · Qolab
Lalitha Immaneni
Vice President, Semiconductor Research & Development, APTM · Intel
Timothy Costa
General Manager and Vice President of Computational Engineering · NVIDIA
William Wang
CEO and Founder · ChipAgents.ai
§II

Underwritten By

The houses behind the program. Tiers as disclosed.
Bronco AIPlatinum
ChipAgents.aiPlatinum
NormalPlatinum
SiemensPlatinum
AgentrysSilver
CadenceSilver
KeysightSilver
RicursiveSilver
SynopsysSilver
Amazon Kuiper SystemsBronze
VerifaixBronze
ACM SIGDAConference Sponsor
IEEEConference Sponsor
IEEE Council on Electronic Design AutomationConference Sponsor
IEEE Solid-State Circuits SocietyTechnical Conference Sponsor
§III

The Programme

Selected from 5 sessions on the bill.
  • Monday, July 27 10:30am - 12:30pm PDT

    Beyond GPUs: Next-Generation Architectures for Modern AI Workloads

    Recent advances in artificial intelligence are increasingly driven by specialized hardware architectures tailored to the computational structure of emerging models. This session pr…

    AI4-I. AI/ML Architecture Design
  • Monday, July 27 10:30am - 12:30pm PDT

    Foundations and Frontiers: Bridging Traditional EDA and Generative AI

    As the complexity of hardware design reaches unprecedented scales, the tools we rely on must evolve to keep pace. This session explores the intersection of foundational EDA techniq…

    EDA5. RTL/Logic Level and High-level Synthesis
  • Monday, July 27 10:30am - 12:30pm PDT

    Hidden in Plain Sight: Designing Systems for Private Intelligence

    This session explores the state of confidential AI systems from fully homomorphic encrypted inference to secure orchestration pipelines and concludes by examining emerging hardware…

    SEC1. AI/ML Security/Privacy
  • Monday, July 27 10:30am - 12:30pm PDT

    Hot Chips & Cool Models: AI Turns Up the Heat on Silicon Design

    Advances in machine learning are enabling new approaches to modeling and optimizing the physical behavior of semiconductor devices, circuits, and architectures. This session presen…

    AI1. AI/ML Frontiers for Hardware Design
  • Monday, July 27 9:00am - 10:00am PDT

    From Fundamental Science to Building a Superconducting Quantum Computer

    Keynote
Intermission
Part the Second · For the Buyer

What does it mean when 25 companies show up — and 2 bet on three roles at once?

25 companies. two are betting more than once.

The numbers below are derived from the speakers, sponsors, and exhibitors on this page — cross-referenced into one ledger. They are the only thing here that 10times.com cannot tell you.

01Fig. 01 — Composition of the House
2All threespeak · spons · exh
13Sponsoringsponsor only
0Exhibitingexhibitor only
10Speakingspeaker only

The Triple-Threat

Bronco AI·ChipAgents.ai

02Fig. 02 — The Voices, by Seniority

92% of the speakers carry senior titles — C-suite, Founder, VP, or Director-level.

  • C-suite542%
  • VP-level542%
  • Director / Head of18%
  • Other roles18%

Of 12 on the bill · classified by free-text title

03Fig. 03 — The Heaviest in the Room
  1. 01Bronco AISp·P1V
  2. 02ChipAgents.aiSp·P1V
  3. 03ACM SIGDASp·C
  4. 04AgentrysSp·S
  5. 05Amazon Kuiper SystemsSp·B
  6. 06CadenceSp·S
  7. 07IEEESp·C
  8. 08IEEE Council on Electronic Design AutomationSp·C
  9. 09IEEE Solid-State Circuits SocietySp·T
  10. 10KeysightSp·S
  11. 11NormalSp·P
  12. 12RicursiveSp·S
  13. 13SiemensSp·P
  14. 14SynopsysSp·S
04Fig. 04 — By Tier
platinum4
27% of 15
silver5
33% of 15
bronze2
13% of 15
conference sponsor3
20% of 15
technical conference sponsor1
7% of 15